ESP32-C3 Series Packaging Information

[中文]

This document summarizes the packaging requirements of Espressif’s ESP32-C3 series of products, including the product silk marking, dry-packing requirements, and product packing.

• Chip Packaging Information
  • Chip Silk Marking
    • Marking Convention
    • Flash Code and PSRAM Code Conventions
      • No Flash, No PSRAM
      • In-package Flash, No PSRAM
  • Chip Product Packing
    • Tape
    • Reel
    • Pin1 Location
    • Pizza Box
  • Dry Packing Requirement
• Module Packaging Information
  • Module Silk Marking
    • Marking Convention
      • Specification Identifier Convention
      • Data Matrix Convention
  • Module Product Packing
    • Tape
    • Reel
    • Pizza Box
  • Dry Packing Requirement
• Disclaimer and Copyright