ESP32-S3 Chip Packaging Information

[中文]

This document summarizes the packaging requirements of Espressif’s ESP32-S3 series of chips, including the chip silk marking, dry-packing requirements, and chip product packing.

• Chip Silk Marking
  • Marking Convention
  • Flash Code and PSRAM Code Conventions
    • No Flash, No PSRAM
    • In-package Flash, No PSRAM
    • In-package PSRAM, No Flash
    • In-package Flash, In-package PSRAM
• Chip Product Packing
  • Tape
  • Reel
  • Pin1 Location
  • Pizza Box
• Dry Packing Requirement